High-brightness light emitting diodes (LEDs), as a strong candidate for the next generation general illumination applications, were developed by improving luminous efficiency and integrating multichips within limited areas. The efficiency and reliability of solid-state lighting devices strongly depend on successful thermal management. Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler.
The results show that better effect of thermal management can get after optimizing layout of bumps, and also show that the more bump number used the better thermal management can get, but there is a best optimal number as there are some other limiting factors such as structure and cost. The effect of the layout and the number of bumps of LED flipchip to thermal management of LED light was analyzed by using FEM simulation. Flipchip s applying is good for improvement of efficiency of light emitting of LED and especially for thermal management. LED solid state lighting (SSL) has a good prospects, but there are some bottlenecks, the one is that efficiency of light emitting is not enough for general lighting, the other is too much heat generated by higher power which affect the efficiency and life of LED. Bump Thermal Management Analysis of LED with Flipchip Package.
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